发明名称 FLUX COMPOSITION, LIQUID FLUX, RESIN FLUX CORED SOLDER, AND SOLDER PASTE
摘要 <p>Provided is a flux composition which is capable of removing an oxide film that is formed on the surface of aluminum, and which does not require cleaning of the flux residue. This flux composition contains, as a base material, 65-94% by mass of a resin that is insoluble in water, while containing at least 3-22% by mass of an amine and 1-30% by mass of an amine fluoride salt that serves as a fluorine-based activator and is produced by a reaction between an amine and an acid. It is preferable that the amine contains at least one substance that is selected from among pyridine derivatives, imidazole derivatives, guanidine derivatives, ethyl amines and picoperine. It is also preferable to contain, as the amine fluoride salt, at least one substance that is selected from among amine-boron trifluoride complexes and salts that are formed from any amine compound selected from among pyridine derivatives, imidazole derivatives, guanidine derivatives, ethyl amines and picoperine and any acid selected from among hydrofluoric acid, hydrofluoboric acid and hexafluorosilicic acid.</p>
申请公布号 WO2013187363(A1) 申请公布日期 2013.12.19
申请号 WO2013JP65954 申请日期 2013.06.10
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 HAGIWARA TAKASHI;YAMASAKI HIROYUKI
分类号 B23K35/363 主分类号 B23K35/363
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