发明名称 |
PLASMA PROCESSING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing apparatus achieving high etching performance and mass production stability without causing abnormal discharge even in high electromagnetic field of an inductively coupled plasma processing apparatus and the like.SOLUTION: A plasma processing apparatus includes: a processing chamber 1; a planar dielectric window 2a; an induction coil 18; a flat-plate electrode 19; a high frequency power source 16; a gas supply means 10; and a sample stage 4 on which a sample 3 is mounted. A process gas supply plate 11a is disposed on the dielectric window in an inner side of the processing chamber, and a recessed part 21a is formed in the flat-plate electrode 19 on a side opposite the induction coil at a position corresponding to a gas supply position 15a of the process gas supply plate 11a. |
申请公布号 |
JP2013254723(A) |
申请公布日期 |
2013.12.19 |
申请号 |
JP20120209582 |
申请日期 |
2012.09.24 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
ZOKU YUSAKU;NISHIO RYOJI;KAWAGUCHI TADAYOSHI;TETSUKA TSUTOMU |
分类号 |
H05H1/46;H01L21/3065 |
主分类号 |
H05H1/46 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|