发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a plasma processing apparatus achieving high etching performance and mass production stability without causing abnormal discharge even in high electromagnetic field of an inductively coupled plasma processing apparatus and the like.SOLUTION: A plasma processing apparatus includes: a processing chamber 1; a planar dielectric window 2a; an induction coil 18; a flat-plate electrode 19; a high frequency power source 16; a gas supply means 10; and a sample stage 4 on which a sample 3 is mounted. A process gas supply plate 11a is disposed on the dielectric window in an inner side of the processing chamber, and a recessed part 21a is formed in the flat-plate electrode 19 on a side opposite the induction coil at a position corresponding to a gas supply position 15a of the process gas supply plate 11a.
申请公布号 JP2013254723(A) 申请公布日期 2013.12.19
申请号 JP20120209582 申请日期 2012.09.24
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 ZOKU YUSAKU;NISHIO RYOJI;KAWAGUCHI TADAYOSHI;TETSUKA TSUTOMU
分类号 H05H1/46;H01L21/3065 主分类号 H05H1/46
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