发明名称 |
Lead frame and method for manufacturing circuit device using the same |
摘要 |
Provided are: a lead frame enabling efficient manufacturing of multiple circuit devices; and a method for manufacturing a circuit device using the same. In the lead frame of the present invention, units are arranged and frame-shaped first and second supporters are provided around the units to mechanically support the units. Moreover, a half groove is provided in the first supporter at a portion on an extended line of a dividing line defined at a boundary between each adjacent two of the units. Furthermore, a penetration groove penetrating a part of the second supporter at a portion on an extended line of another dividing line is provided. |
申请公布号 |
US8609467(B2) |
申请公布日期 |
2013.12.17 |
申请号 |
US20090415423 |
申请日期 |
2009.03.31 |
申请人 |
FUKUSHIMA TETSUYA;KITAZAWA TAKASHI;SANYO SEMICONDUCTOR CO., LTD.;SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
FUKUSHIMA TETSUYA;KITAZAWA TAKASHI |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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