PROCESSING OBJECT CUTTING METHOD, PROCESSING OBJECT, AND SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a processing object cutting method capable of manufacturing a semiconductor element while suppressing influences of a crystal structure of a hexagonal compound, and to provide a processing object and a semiconductor element.SOLUTION: Predetermined cutting lines 51 and 52 for cutting a processing object 1 are set so as not to be in parallel to each of an a-plane and an m-plane of a hexagonal compound. Laser light L is radiated along the predetermined cutting lines 51 and 52 that are set in such a way to form modification regions 71 and 72. The processing object 1 is cut by using the modification regions 71 and 72 as initial points. Thereby, a semiconductor element 10 can be manufactured by cutting the processing object 1 while suppressing influences of a crystal structure of the hexagonal compound configuring a substrate 31.