| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be small-sized (thinned) and improve productivity, an electronic apparatus and a mobile object including the semiconductor device.SOLUTION: A gyro sensor 1 comprises a package base 11 including, on a principal surface 14, an internal terminal 15 where a first protruding electrode 15a in a convex shape is provided, and an IC chip 20A including, at the side of an active surface 21, a second connection terminal 23 in which a second protruding electrode 23a in the convex shape is provided. In the IC chip 20A, the active surface 21 is upright to the principal surface 14 of the package base 11, and is disposed on the principal surface 11 in such a manner that the first protruding electrode 15a and the second protruding electrode 23a are overlapped with each other at least partially in a plan view. The first protruding electrode 15a and the second protruding electrode 23a are connected at least partially while being fused to each other. |
