| 摘要 |
<p>A wireless communication device (100) includes a wireless IC device (1), a multilayer substrate (2) including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device (1) and that includes a capacitance element provided in the multilayer substrate (2) and an inductance element (8) provided outside the multilayer substrate (2), and a radiation conductor (5) connected to the resonant circuit.</p> |
