| 摘要 |
PROBLEM TO BE SOLVED: To facilitate optimization of radio communication means between stacked semiconductor chips, and minimize a semiconductor device.SOLUTION: A semiconductor device includes: a first semiconductor chip in which a re-distribution layer is formed on its rear face; and a second semiconductor chip stacked in a face-down way above the rear face of the first semiconductor chip. Power is supplied to the second semiconductor chip via the re-distribution layer. |
