| 摘要 |
PROBLEM TO BE SOLVED: To reliably keep clearances among chips obtained by expansion and division of an expanded sheet that is stuck to a workpiece regardless of a type of the expanded sheet thereby to reduce risk of damages on the chips.SOLUTION: A division method of a workpiece comprises: an expansion step of dividing a wafer (workpiece) 1 from a modified layer 4 by expanding an expanded sheet 11 to form a plurality of chips 3A and form clearances among the chips 3A; an excess protrusion step of protruding an excess 11b that is formed by expansion of the expanded sheet 11, to a rear face 5b side of a wafer unit (workpiece unit) 5 between an outer periphery of the wafer 1 and an inner periphery of an annular frame 10; and a press bonding step of press bonding the excess 11b protruded to the rear face 5b side on a rear face side of the annular frame 10 thereby to keep clearances among the chips 3A. |
