| 摘要 |
PROBLEM TO BE SOLVED: To provide a protective tape sticking method which allows easy sticking of a protective tape, having an annular adhesive layer only on the periphery corresponding to the periphery of a wafer, to the wafer while positioning.SOLUTION: The protective tape sticking method for sticking a protective tape, having a diameter corresponding to that of a wafer and provided with an annular adhesive layer only on the periphery corresponding to that of the wafer, includes: a first mark formation step for forming a plurality of first marks on the periphery of the wafer; a second mark formation step for forming a plurality of second marks corresponding to the first marks on the adhesive layer of the protective tape; and a protective tape sticking step for sticking the protective tape to the wafer while matching the first marks of the wafer and the second marks of the protective tape. |
