| 摘要 |
Disclosed is a wafer processing film comprising an adhesive layer and a dicing/die bonding film that is composed of a sticky film. The wafer processing film can be sufficiently suppressed in the formation of transfer marks in the adhesive layer when wound up in a roll. Specifically disclosed is a wafer processing film (10) which comprises: a sticky film (14) that is composed of a long base film (11) and a long film-like sticky agent layer (12) provided on the base film (11); and a long film-like adhesive layer (13) that is provided on the sticky agent layer (12). The sticky agent layer (12) contains a radiation-polymerizable compound and a photoinitiator. The sticky agent layer (12) is not pre-cut in a shape corresponding to a ring frame (20), and the adhesive layer (13) is not pre-cut in a shape corresponding to a semiconductor wafer (W). |
