发明名称 MULTILAYER SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a multilayer substrate that allows maintaining a curved state without varying the electrical characteristics.SOLUTION: The multilayer substrate includes: a body including a stack of a plurality of insulating sheets; a signal line extending in the body; a first ground conductor provided closer to one side of the stacking direction than to the signal line in the body; and a second ground conductor provided closer to the other end of the stacking direction than to the signal line in the body. The insulating sheets are composed of a material having Young's modulus of 2 GPa or more to 30 GPa or less. The first and second ground conductors are composed of a metal film having a thickness of 5 μm or more to 25 μm or less and Young's modulus of 100 GPa or more to 150 GPa or less. The distance between the first ground conductor and the second ground conductor in the stacking direction ranges from 50 μm or more to 200 μm or less, and the first ground conductor and the second ground conductor are provided in parallel to each other.
申请公布号 JP2013236108(A) 申请公布日期 2013.11.21
申请号 JP20130167937 申请日期 2013.08.13
申请人 MURATA MFG CO LTD 发明人 KATO NOBORU;SASAKI JUN;ISHINO SATOSHI
分类号 H05K1/02;H01P3/08 主分类号 H05K1/02
代理机构 代理人
主权项
地址