| 摘要 |
<p>A substrate (1) with a built-in electronic component, the substrate (1) having a configuration in which a substrate (2) and a sealing layer (3) are layered. The substrate (2) has an electronic component (21) mounted on the first principal surface. The sealing layer (3) is made from an insulating resin, and seals the electronic component (21) mounted on the first principal surface. Pins (5a, 5b) are electroconductive and longer than the thickness of the substrate (2). The pins (5a, 5b) are provided upright so as to penetrate the substrate (2). The pin (5a) is exposed at the side surface positioned between: the second principal surface of the substrate (1) with a built-in electronic component, the second principal surface being the surface opposite the first principal surface; and the surface of the sealing layer opposite the surface that comes into contact with the first principal surface.</p> |
