Semiconductor application method and product

摘要

A method of applying a semiconductor element to a substrate comprising the steps of: defining a primary element position 2 on a substrate 1 for application of a semiconductor element; defining a secondary element position 3 on the substrate 1 for applying a semiconductor element; attempting to apply a semiconductor element onto the substrate 1 in the primary position 2; checking whether or not the application of the semiconductor element in the primary position 2 has been successful; and if said checking indicates that the application of the semiconductor element in the primary position 2 has not been successful, attempting to apply a semiconductor element onto the substrate 1 at the secondary position 3; wherein the functionality of electrical connections 5a-o from the primary element position 2 to other parts of the substrate are duplicated at the secondary element position 3. Also disclosed is the above substrate 1. The present invention allows for re-mounting of the semiconductor element after a failed mounting in a primary position without having to re-use the primary element position which may contain contaminants (from adhesives/solder) or might have been damaged by the removal of such contaminants.