| 摘要 |
PURPOSE: A nozzle unit, an apparatus including the same, and a substrate treating method using the same are provided to spray shield gas on the inner wall of a process chamber or a support unit through a second nozzle, thereby preventing a parasitic deposition phenomenon. CONSTITUTION: A support unit supports a substrate. A nozzle unit(1400) is arranged in a process chamber. The nozzle unit includes a first nozzle(1450) and a second nozzle(1460). The first nozzle sprays process gas. The second nozzle sprays shield gas on the inner wall of the process chamber or the support unit. |
