| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that reliability of an electronic component is deteriorated by cracks generated in a filling resin in the electronic component whose structure is filled with the filling resin after an element of the electronic component is accommodated within a metallic or resin case. SOLUTION: The electronic component includes a structure in which an element 2 connected with lead terminals 5, 6 including bending portions 7, 8, 9, and 10 is accommodated within a housing part 13, the housing part 13 is filled with a first resin 17 to embed the element 2, and a second resin 18 more soft than the first resin 17 is provided in the periphery of the bending portions 7, 8, 9, and 10 of the lead terminals 5, 6. COPYRIGHT: (C)2010,JPO&INPIT |
