SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be supplied with sufficient power while suppressing an increase in manufacturing cost.SOLUTION: The semiconductor device includes: a semiconductor substrate SS1; a multilayer wiring layer ML1 provided on the semiconductor substrate SS1; an Al wiring layer PM1 provided on the multilayer wiring layer ML1 and having a pad part PD1; and a rewiring layer EG1 provided on the Al wiring layer PM1 and connected to the Al wiring layer PM1. The rewiring layer EG1 is constituted of a metal material having an electrical resistivity lower than that of Al and is not formed on the pad part PD1.