Enclosure For Heat Transfer Devices, Methods Of Manufacture Thereof And Articles Comprising The Same

摘要

Disclosed herein is a heat transfer device (100) that includes a shell (102); the shell (102) being an enclosure that prevents matter from within the shell (102) from being exchanged with matter outside the shell (102) during the operation of the heat transfer device (100); the shell (102) having an outer surface (111 and 121) and an inner surface (109 and 119); and a porous layer disposed on the inner surface (109 and 119) of the shell (102); the porous particle layer (160) having a thickness effective to enclose a vapor space (150) between opposing faces; the vapor space (150) being effective to provide a passage for the transport of a fluid; the heat transfer device (100) having a thermal conductivity of greater than or equal to about 10 watts per meter-Kelvin and a coefficient of thermal expansion that is substantially similar to that of a semiconductor.