发明名称 Interfacial Convective Assembly for High Aspect Ratio Structures Without Surface Treatment
摘要 A method for assembling colloidal particles onto a substrate surface through fluid transport. The method comprises placing a first fluid placed adjacent to the substrate surface, applying a colloidal dispersion on top of the first fluid layer and removal of the first fluid layer. The method is extremely versatile, and is especially useful in depositing colloidal materials in high aspect ratio channels and vias without the need for prior treatment of the surface.
申请公布号 US2013287999(A1) 申请公布日期 2013.10.31
申请号 US201113702133 申请日期 2011.06.07
申请人 CHA NAM-GOO;EHEGOYEN YOLANDA;BUSNAINA AHMED;KIM TAEHOON;NORTHEASTERN UNIVERSITY 发明人 CHA NAM-GOO;EHEGOYEN YOLANDA;BUSNAINA AHMED;KIM TAEHOON
分类号 B81B1/00;B32B3/18;B81C1/00 主分类号 B81B1/00
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