发明名称 |
HOUSING FOR ELECTRIC AND ELECTRONIC COMPONENTS USING SHAPE MEMORY MATERIAL |
摘要 |
PURPOSE: A housing of an electronic and electric component which uses a shape memory material is provided to actively control thermal conductivity by reacting to an ambient temperature environment. CONSTITUTION: An inner panel (11) and an outer panel (12) are arranged in a line at a fixed interval. A metal plate (13) of ribbon type is formed to be extended from the inner surface of the outer panel. A shape memory material (14) of ribbon type is connected or separated from the metal plate of the outer panel according to a temperature change. The metal plate and the shape memory material are formed at a right angle about the panel. The metal plate and the shape memory material form or block a thermal transmission path in a housing thickness direction. |
申请公布号 |
KR20130119076(A) |
申请公布日期 |
2013.10.31 |
申请号 |
KR20120041947 |
申请日期 |
2012.04.23 |
申请人 |
HYUNDAI MOTOR COMPANY |
发明人 |
KWAK, JIN WOO;SONG, KYONG HWA;CHOI, BYUNG SAM;LEE, HAN SAEM |
分类号 |
H05K7/20;H05K5/02 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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