发明名称 |
SYSTEMS AND METHODS FOR FORMING A LAYER OF SPUTTERED MATERIAL |
摘要 |
The present disclosure describes a method of coating a substrate, the method including forming a layer of sputtered material on the substrate. Forming the layer of sputtered material may include: sputtering material from at least one rotatable target over the substrate; varying the relative position between the at least one target and the substrate. In addition, the present disclosure describes varying the distance between a target and a substrate during the sputter process. The present disclosure further describes a system for coating a substrate.
|
申请公布号 |
US2013284590(A1) |
申请公布日期 |
2013.10.31 |
申请号 |
US201113876826 |
申请日期 |
2011.07.22 |
申请人 |
BENDER MARCUS;HANIKA MARKUS;SCHEER EVELYN;PIERALISI FABIO;MAHNKE GUIDO;LINDENBERG RALPH;LOPP ANDREAS;SCHWANITZ KONRAD;LIU JIAN;APPLIED MATERIALS, INC. |
发明人 |
BENDER MARCUS;HANIKA MARKUS;SCHEER EVELYN;PIERALISI FABIO;MAHNKE GUIDO;LINDENBERG RALPH;LOPP ANDREAS;SCHWANITZ KONRAD;LIU JIAN |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|