发明名称 MOLDING PACKAGING MATERIAL, AND MOLDING CASE
摘要 PROBLEM TO BE SOLVED: To provide a molding packaging material preventing a black ink layer from being partially cracked to be peeled at molding and sealing and even at use under slightly severe environment such as high temperature and humidity environment or the like.SOLUTION: A molding packaging material 1 contains a heat resistant resin layer 2 as an outside layer, a thermoplastic resin layer 3 as an inside layer, a metal foil layer 4 arranged between both of these layers and a black ink layer 10 arranged between the metal foil layer 4 and the heat resistant resin layer 2. The black ink layer 10 contains carbon black, diamine, polyol and a curing agent.
申请公布号 JP2013224014(A) 申请公布日期 2013.10.31
申请号 JP20130015192 申请日期 2013.01.30
申请人 SHOWA DENKO PACKAGING CO LTD 发明人 NANBORI YUJI;MINAMITANI KOJI;KURAMOTO AKINOBU
分类号 B32B15/08;B65D65/40;H01M2/02 主分类号 B32B15/08
代理机构 代理人
主权项
地址