| 摘要 |
The present invention provides a film formation method and a film formation apparatus, wherein can cure a film material attached on a substrate without reducing throughput capacity. The film formation method comprises the steps of keeping a substrate on an object stage, spraying liquid drops of the photocuring film material from a sprayer, enabling the liquid drops of the film material to fall on the surface of the substrate, irradiating light to the film material fallen on the substrate with a temporary curing light source, and curing the surface layer portion of the film material, and then carrying out the substrate from the object stage after liquid drop falling step and the film material curing step. |
