| 摘要 |
PROBLEM TO BE SOLVED: To provide a processing device capable of stopping the operation of a device when a processing defect occurs in a ground and polished wafer.SOLUTION: A processing device includes: wafer holding means 4 for holding a wafer; grinding means 5, 50 for grinding a wafer held by the wafer holding means 4; polishing means 7 for polishing a wafer held by the wafer holding means 4; cleaning means 130 for cleaning a ground and polished wafer; processing state detection means 8, 9 for detecting the processing state of a wafer where grinding, polishing and cleaning are terminated; and control means for controlling the respective means on the basis of detection signals from the processing state detection means 8, 9. The control means determines the quality of a processing state of a wafer on the basis of detection signals from the processing state detection means 8, 9, outputs a processing defect message to alarm means when a processing defect is determined, and also stops the operation of the respective means. |
