发明名称 |
Optical Module Base and Optical Module |
摘要 |
An optical module base is made up of a plurality of lead frames and a resin structure integrally molded with the lead frames and has an optical device mounting part and an optical waveguide mounting part which are formed in the resin structure. Each of the lead frames includes a connection part to which an optical device is to be mounted and electrically connected and a lead part which is continuous with the connection part. A portion of the thickness of the connection part is embedded in the resin structure and is positioned at the optical device mounting part. A sufficient strength of fixing a lead frame on a resin structure integrally molded with the lead frame can be ensured even if the sizes of the lead frames are miniaturized according to the sizes of electrodes of an optical device to be flip-chip bonded.
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申请公布号 |
US2013279861(A1) |
申请公布日期 |
2013.10.24 |
申请号 |
US201313857996 |
申请日期 |
2013.04.06 |
申请人 |
JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED |
发明人 |
HASHIGUCHI OSAMU |
分类号 |
G02B6/42 |
主分类号 |
G02B6/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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