发明名称 Solid-state imaging device and electronic apparatus
摘要 A solid-state imaging device includes an image sensor chip and a signal processing chip, which are electrically connected. A low thermal conductivity region is positioned between the image sensor chip and the signal processing chip. The low thermal conductivity region is configured to insulate the image sensor chip from heat, which may be generated by the signal processing chip.
申请公布号 EP2400551(A3) 申请公布日期 2013.10.23
申请号 EP20110169976 申请日期 2011.06.15
申请人 SONY CORPORATION 发明人 SASANO, KEIJI;TANAKA, HIROAKI;HAGIWARA, HIROKI;TSUJI, YUKI;WATANABE, TSUYOSHI;TSUCHIYA, KOJI;TANAKA, KENZO;WADA, TAKAYA;YOSHIDA, HIROKAZU;KAWABATA, NOBORU;YOKOYAMA, HIRONOR
分类号 H01L27/146 主分类号 H01L27/146
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