| 摘要 |
An electronic device includes a layered piezoelectric element and a driven member. The driven member is bonded to the top surface of the layered piezoelectric element by means of an epoxy resin adhesive. The piezoelectric element includes a side electrode on one side surface of the element, which is one of the outer surfaces of the element. The piezoelectric element includes, in the vicinity of the upper end portion of the side surface, a dam portion formed of a material for preventing epoxy bleed out of the adhesive. Therefore, even when the epoxy bleed out of the adhesive occurs, a bled-out portion of the components of the adhesive does not reach the side electrode. Thus, when the side electrode is connected to an external circuit by, for example, soldering, reduction in the connection strength or similar problems are avoided.
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