发明名称 |
SEALED PACKAGING FOR MICROELECTROMECHANICAL SYSTEMS |
摘要 |
One example includes an integrated circuit including at least one electrical interconnects disposed on an elongate are extending away from a main portion of the integrated circuit and a microelectromechanical layer including an oscillating portion, the microelectromechanical layer coupled to the main portion of the integrated circuit, wherein the microelectromechanical layer includes a cap comprising a membrane that extends to the integrated circuit.
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申请公布号 |
US2013270660(A1) |
申请公布日期 |
2013.10.17 |
申请号 |
US201113821589 |
申请日期 |
2011.09.18 |
申请人 |
BRYZEK JANUSZ;BLOOMSBURGH JOHN GARDNER;ACAR CENK;FAIRCHILD SEMICONDUCTOR CORPORATION |
发明人 |
BRYZEK JANUSZ;BLOOMSBURGH JOHN GARDNER;ACAR CENK |
分类号 |
H01L29/84 |
主分类号 |
H01L29/84 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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