发明名称 CONNECTING DEVICE FOR ELECTRONIC COMPONENTS
摘要 The device (1) has an insulating film and two electrically conducting films, where the device is formed with a laminate. The laminate is arranged in a layer composition of the conducting films with insulation. A conducting path (12) is formed by the conducting films. The conducting films have a main surface of the laminate, which is made of metal. The film section has a metal layer (122), which is thinner than the films.
申请公布号 KR101319208(B1) 申请公布日期 2013.10.16
申请号 KR20070029614 申请日期 2007.03.27
申请人 发明人
分类号 H01L23/12;H01L27/02 主分类号 H01L23/12
代理机构 代理人
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