| 摘要 |
<p>A heat dissipation device comprises a base, a heat dissipation fin, and a protruding element. The heat dissipation fin comprises a heat dissipation portion, a fixing portion, and a first anti-overflow structure. The fixing portion is fixed in the base, and the first anti-overflow structure is connected between the heat dissipation portion and the fixing portion. The width of the first anti-overflow structure is greater than the width of the heat dissipation portion. A first hole is formed in the heat dissipation portion and the first anti-overflow structure. The protruding element comprises a second anti-overflow structure and a first protruding portion, and the first protruding portion protrudes from an upper surface of the second anti-overflow structure. The protruding element is disposed in the first hole, and a lower surface of the second anti-overflow structure is coplanar with a lower surface of the first anti-overflow structure.</p> |
