| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer which can be easily identified even after wafer direct bonding and which is unlikely to break.SOLUTION: A semiconductor wafer of a present embodiment comprises: a disc-like wafer body 10 composed of silicon; and an identification groove 20 which is provided on a circumference of the wafer body and has at least one groove. The groove opens on the circumference of the wafer body and has a depth less than a thickness of the wafer body. |
