发明名称 |
Electronic devices with yielding substrates |
摘要 |
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts. |
申请公布号 |
US8552463(B2) |
申请公布日期 |
2013.10.08 |
申请号 |
US201313751563 |
申请日期 |
2013.01.28 |
申请人 |
TISCHLER MICHAEL A.;SCHICK PHILIPPE M.;ASHDOWN IAN;SHEEN CALVIN WADE;JUNGWIRTH PAUL;COOLEDGE LIGHTING INC. |
发明人 |
TISCHLER MICHAEL A.;SCHICK PHILIPPE M.;ASHDOWN IAN;SHEEN CALVIN WADE;JUNGWIRTH PAUL |
分类号 |
H01L33/00;H01L21/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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