| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate which enables electrodes to be certainly bonded by wafer bonding while reducing a stress acting on a peripheral part of an electrode array.SOLUTION: A substrate comprises: a base material having a predetermined thickness; and an electrode array 20 which is provided on one surface of the base material in a thickness direction and in which a plurality of electrodes are arranged two-dimensionally in planar view. The electrode array includes a central part 20B and a gradually-increasing region 20A provided around the central part in planar view. In the gradually-increasing region, the electrodes are formed such that a height of the electrode gradually increases with the decreasing distance to the central part. |
