| 摘要 |
PROBLEM TO BE SOLVED: To provide a vibration device that realizes a reduction in size of a semiconductor substrate on which a vibration element is mounted.SOLUTION: A vibration device includes: a semiconductor substrate; a first electrode provided on a first surface of the semiconductor substrate; a protective layer that covers an end portion of the first surface and is provided on the first surface; and a vibration element including vibration sections, mass adjustment sections positioned at the vibration sections and a second electrode. The vibration element is positioned in a region where the mass adjustment sections overlap with the protective layer as viewed in a plan view and a part of the vibration element is disposed at a position where the part of the vibration element does not overlap with the first surface as viewed in the plan view. The first electrode and the second electrode are connected to each other and are mounted on the first surface. |
