| 摘要 |
PROBLEM TO BE SOLVED: To satisfy both of inhibition of resin leakage at the time of forming an encapsulation resin and inhibition of damages on a functional wiring area of a wiring board.SOLUTION: A semiconductor device manufacturing method comprises a process of mold clamping a wiring board 57 with a first die 52 and a second die 51. The second die 51 includes a flat part 60 contacting the wiring board 57, a recess 53 which forms a cavity for encapsulation resin formation, and a projection 23 which is formed at a position on the flat part 60 and away from the recess 53 and which projects on the first die 52 side and extends along a first side of the wiring board 57. |
