发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 Disclosed herein is a printed circuit board, including: a base substrate having an outer layer circuit; an insulating layer formed partially on the base substrate; and a circuit layer formed on the insulating layer.
申请公布号 US2013256023(A1) 申请公布日期 2013.10.03
申请号 US201313853534 申请日期 2013.03.29
申请人 CO., LTD. SAMSUNG ELECTRO-MECHANICS;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM EUNG SOO
分类号 H05K3/10;H05K1/02;H05K1/11 主分类号 H05K3/10
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