发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Disclosed herein is a printed circuit board, including: a base substrate having an outer layer circuit; an insulating layer formed partially on the base substrate; and a circuit layer formed on the insulating layer. |
申请公布号 |
US2013256023(A1) |
申请公布日期 |
2013.10.03 |
申请号 |
US201313853534 |
申请日期 |
2013.03.29 |
申请人 |
CO., LTD. SAMSUNG ELECTRO-MECHANICS;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM EUNG SOO |
分类号 |
H05K3/10;H05K1/02;H05K1/11 |
主分类号 |
H05K3/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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