ADHESIVE TAPE FOR SEMICONDUCTOR WAFER SURFACE PROTECTION

摘要

PROBLEM TO BE SOLVED: To provide an adhesive tape for semiconductor wafer surface protection which can prevent adhesive deposit, dust and immersion of grinding water; grind the semiconductor wafer with high thickness accuracy (TTV); and reduce warpage and breakage of the semiconductor wafer.SOLUTION: An adhesive tape for semiconductor wafer surface protection of a present embodiment is an adhesive tape for semiconductor wafer surface protection including an adhesive layer on a base material film. Adhesion to a stainless steel (Steel Use Stainless: SUS) at normal temperature is 0.8-2.5 N/25 mm, and when heated to 50°C, adhesion is not greater than 1 N/25 mm and a stress-relaxation rate is 10-18%.