| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability on the bottom surface of a via hole used for interlayer conduction. SOLUTION: A printed wiring board includes: a first isolation layer 21a that has flexibility; a seed layer 22a provided on a first main surface of the first isolation layer 21a; a first conductor circuit 23a provided on the seed layer 22a; and an interlayer conduction part 24a that is embedded in a via hole penetrating through the first isolation layer 21a and contacts a first alloy layer 28a formed between the seed layer 22a exposed on the bottom surface of the via hole and the first conductor circuit 23a. The compatibility between the interlayer conduction part 24a and the first alloy layer 28a is higher than the compatibility between the interlayer conduction part 24a and the seed layer 22a. A second alloy layer 27a made of an alloy of the first alloy layer 28a and the interlayer conduction part 24a is provided on a part contacting the interlayer conduction part 24a of the first alloy layer 28a. COPYRIGHT: (C)2012,JPO&INPIT |
