SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE: A semiconductor integrated circuit device is provided to use the same die pad irrespective of the P or N polarity of a semiconductor substrate by independently setting the electric potential of the die pad. CONSTITUTION: A semiconductor integrated circuit (IC) includes a P-type semiconductor substrate (1). A metallic die pad (9) is mounted on the semiconductor IC. The die pad comprises a terminal except the terminals for minimum potential of a semiconductor IC operation. An insulating paste (8) has a volume resistivity of 1×1012 Ω·cm or more. The semiconductor IC and the die pad are bonded to each other by the volume resistivity.