发明名称 Atomic layer deposition apparatus
摘要 A reactor configured to subject a substrate to alternately repeated surface reactions of vapor-phase reactants is disclosed. The reactor may include a reaction chamber that defines a reaction space and a gas flow control guide structure; and a substrate holder. The gas flow control guide includes one or more channels. Each of the channels widens as the channel extends from the inlet to the reaction space. At least one of the channels is configured to generate a non-uniform laminar flow at a first portion of the periphery of the reaction space such that the laminar flow includes a plurality of flow paths that provide different amounts of a fluid. The reaction chamber may include a reactor base and a reactor cover detachable from each other; and a driver configured to independently adjust at least three portions of the reactor base to provide a substantially perfect seal to the reactor space.
申请公布号 US8545940(B2) 申请公布日期 2013.10.01
申请号 US201213598998 申请日期 2012.08.30
申请人 CHOI SEUNG WOO;PARK GWANG LAE;LEE CHUN SOO;LEE JEONG HO;CHOI YOUNG SEOK;ASM GENITECH KOREA LTD. 发明人 CHOI SEUNG WOO;PARK GWANG LAE;LEE CHUN SOO;LEE JEONG HO;CHOI YOUNG SEOK
分类号 C23C16/18;C23C16/06;C23C16/455 主分类号 C23C16/18
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