| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for surely removing an oxide film on an aluminum conductive member and to achieve low resistance bonding with solder while preventing re-oxidation.SOLUTION: A liquid film of flux is formed on an aluminum conductive member, an oxide film is removed physically over the liquid film, and a solder is coated thereon. By performing a reflow treatment in this state, the low resistance bonding is achieved while preventing re-oxidation between the aluminum conductive member and a solder bump. |
