| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling type semiconductor element in which bumps are not apt to contact each other during cooling.SOLUTION: For each pixel which is formed on a first semiconductor substrate 1 and has area L, a first bump 11 and a second bump 12 are so arranged that the interval between the center of the first bump 11 and the center of the second bump 12 is (2/3±0.1)×L, adjacent pixels have mutually orthogonal extension directions of segments connecting centers of first bumps 11 and centers of second bumps 12, and the interval between the midpoints of the segments of the adjacent pixels is L, and the first semiconductor substrate and a second semiconductor substrate of a different substrate material from a first semiconductor are joined together in a hybrid manner with the first pumps and the second bumps. |
