发明名称 RESIN SEALING TYPE ELECTRONIC APPARATUS AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To eliminate a need for removing a tie bar after formation of a mold resin and inhibit short circuits between leads.SOLUTION: A resin member (14) binds adjacent leads (12) and has a tie bar part (40) functioning as a dam of the mold resin (13). Further, the resin member (14) has a partition part (41) integrally provided with the tie bar part (40). The partition part (41) faces a facing region of an outer lead part (31) in the adjacent lends (12) and is disposed in at least a part of the facing region.
申请公布号 JP2013191696(A) 申请公布日期 2013.09.26
申请号 JP20120056263 申请日期 2012.03.13
申请人 DENSO CORP 发明人 SHIOTANI YASUHIRO;YOSHIMIZU SEI
分类号 H01L23/28;H01L23/50 主分类号 H01L23/28
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