| 摘要 |
An inspection chamber 14 of a wafer inspection apparatus includes a probe card 20 having probes 25 on a surface facing a wafer W; a pogo frame 40 contacted with a surface of the probe card 20 opposite to the surface facing the wafer W; a chuck member 23 disposed to face the probe card 20; positioning pins 61 provided on the chuck member 23. Further, a transfer device 13 includes a transfer arm 13A having recesses 62 to be fitted to the positioning pins 61. The probe card 20 loaded into the inspection chamber 14 by the transfer arm 13A is aligned with the positioning pins 61, and the wafer W loaded into the inspection chamber 14 is aligned with the positioning pins 61. Accordingly, the probe card 20 and the wafer W are located at electrical characteristic inspection positions where electrical characteristics of semiconductor devices are inspected.
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