发明名称 Semiconductor discharge devices and methods of formation thereof
摘要 In one embodiment, a method of forming a semiconductor device includes forming a well region within a substrate. A plurality of transistors is formed within and/or over the well region. The method further includes forming a first discharge device within the substrate. The first discharge device is coupled to the well region and a low voltage node. During subsequent processing, the first discharge device discharges charge from the well region.
申请公布号 US8541845(B2) 申请公布日期 2013.09.24
申请号 US201113004334 申请日期 2011.01.11
申请人 SCHUETZ ALFRED;MARTIN ANDREAS;ZIMMERMANN GUNNAR;INFINEON TECHNOLOGIES AG 发明人 SCHUETZ ALFRED;MARTIN ANDREAS;ZIMMERMANN GUNNAR
分类号 H01L27/092;H01L21/336 主分类号 H01L27/092
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