| 摘要 |
The sensor (1) has a sensor chip (2) formed as a microelectromechanical system and provided with a sensor element (4), an electronic evaluation circuit (5) and an electronic oscillator (3). The sensor chip is separated into two regions (9, 10) and is fastened on a support element (7) by an adhesive (6) in one of the regions. The sensor element and the electronic oscillator are arranged in another region (9). The support element is formed as a punched sheet-metal, and the sensor element is formed as a membrane. A temperature sensor and a heat element are formed on the membrane. |
