| 摘要 |
A wiring substrate of the present invention has, on a first dummy wiring disposing section (105a) in a first lead-out wiring section (105), a dummy wiring line (2) that is formed of a light-shielding metal in positions that correspond to a front and a rear of a bent portion (10) of a wiring line (1) by having an insulating layer therebetween. As a result, sufficient countermeasures against disconnection of the wiring line (1) are taken in the first lead-out wiring section, and a sufficient aperture ratio for seal curing with UV radiation can be ensured.
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