| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a required circuit scale cannot be formed on a ceramic substrate in a BGA structure where the ceramic substrate is connected with a resin substrate with a number of bumps because when the ceramic substrate is enlarged, thermal stress acting on the bumps positioned at an outer edge part becomes large and a connection part is damaged.SOLUTION: Bumps placed in a size area where thermal stress breakage does not occur are fixed by solder joint. As for bumps in other regions, spring contact terminals are attached to a ceramic substrate and are placed in slidable contact with electrodes of a resin substrate by crimping. |
