发明名称 |
MULTI-CHANNEL OPTICAL TRANSMISSION MODULE AND MANUFACTURING METHOD THEREOF |
摘要 |
PROBLEM TO BE SOLVED: To provide a multi-channel optical transmission module that can be mounted without damaging a semiconductor waveguide even when an entire array chip face is pressurized by using an array chip in which a wiring board support section is integrated, and that can have a sufficient high frequency characteristic which is a characteristic of flip-chip mounting for all channels while securing a heat dissipation property and restraining costs.SOLUTION: A multilayer channel optical transmission module according to the present invention comprises: an LD carrier; a semiconductor element array mounted on the LD carrier and provided with an optical function section and a wiring board support section; a flip-chip wiring board arranged above the semiconductor element array and fixed to the wiring board support section; and a gold bump that is high frequency wiring for connecting an electrode formed on a surface of the optical function section and the flip-chip wiring board. Maximum thickness of the wiring board support section is equal to or higher than that of the optical function section. |
申请公布号 |
JP2013187230(A) |
申请公布日期 |
2013.09.19 |
申请号 |
JP20120049074 |
申请日期 |
2012.03.06 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
KANAZAWA SHIGERU;OKI AKIRA;SHIBATA YASUO;NUNOTANI NOBUHIRO |
分类号 |
H01S5/22 |
主分类号 |
H01S5/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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