发明名称 MULTI-CHANNEL OPTICAL TRANSMISSION MODULE AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a multi-channel optical transmission module that can be mounted without damaging a semiconductor waveguide even when an entire array chip face is pressurized by using an array chip in which a wiring board support section is integrated, and that can have a sufficient high frequency characteristic which is a characteristic of flip-chip mounting for all channels while securing a heat dissipation property and restraining costs.SOLUTION: A multilayer channel optical transmission module according to the present invention comprises: an LD carrier; a semiconductor element array mounted on the LD carrier and provided with an optical function section and a wiring board support section; a flip-chip wiring board arranged above the semiconductor element array and fixed to the wiring board support section; and a gold bump that is high frequency wiring for connecting an electrode formed on a surface of the optical function section and the flip-chip wiring board. Maximum thickness of the wiring board support section is equal to or higher than that of the optical function section.
申请公布号 JP2013187230(A) 申请公布日期 2013.09.19
申请号 JP20120049074 申请日期 2012.03.06
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 KANAZAWA SHIGERU;OKI AKIRA;SHIBATA YASUO;NUNOTANI NOBUHIRO
分类号 H01S5/22 主分类号 H01S5/22
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