| 摘要 |
A thermally conductive silicone composition comprising: (A) an organopolysiloxane that is liquid at 25°C and preferably has a viscosity of from 100 to 1,000,000 mPa.s; (B) an aluminum oxide powder having an average particle size of not more than 10 mum and preferably from 1 to 8 µm; and (C) an aluminum hydroxide powder having an average particle size of greater than 10 µm and preferably not greater than 50 µm, has low thixotropy, low specific gravity, and high thermal conductivity. |
