CONTACT PIN FOR TESTING A BGA PACKAGE

摘要

PURPOSE: A contact pin for testing a ball grid array (BGA) package is provided to implement large contact force by contacting with the center of a solder ball closely. CONSTITUTION: A contact pin for testing a BGA package includes a first and a second pin head unit (121,122) and a pin leg (130). The first and the second pin head unit are symmetrically formed as being extended to the upper side of a pin body (110) as facing with each other. The pin leg unit is extended to the lower side of the pin body part. A contact part contacting with a solder ball in the upper part of the first and the second pin head unit makes a first and a second contact protrusion part (121a,122a) be protruded vertically. The first and the second contact protrusion part have a slope in which the horizontal distance with the vertical center line of the solder ball becomes shorter as going to the upper direction.